BKH2125HW102-T [TAIYO YUDEN]

MULTILAYER CHIP BEAD INDUCTORS (BK SERIES); 多层片状磁珠电感器( BK系列)
BKH2125HW102-T
型号: BKH2125HW102-T
厂家: TAIYO YUDEN (U.S.A.), INC    TAIYO YUDEN (U.S.A.), INC
描述:

MULTILAYER CHIP BEAD INDUCTORS (BK SERIES)
多层片状磁珠电感器( BK系列)

电感器
文件: 总27页 (文件大小:1712K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Notice for TAIYO YUDEN products  
Please read this notice before using the TAIYO YUDEN products.  
REMINDERS  
Product information in this catalog is as of October 2011. All of the contents specified herein are subject to change  
without notice due to technical improvements, etc. Therefore, please check for the latest information carefully be-  
fore practical application or usage of the Products.  
Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorpo-  
rating such products, which are caused under the conditions other than those specified in this catalog or individual  
specification.  
Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual specification is  
available.  
Please conduct validation and verification of products in actual condition of mounting and operating environment  
before commercial shipment of the equipment.  
All electronic components or functional modules listed in this catalog are developed, designed and intended for  
use in general electronics equipment.(for AV, office automation, household, office supply, information service,  
telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any  
equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal,  
disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have  
direct influence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance.  
Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, subma-  
rine system, military, etc. where higher safety and reliability are especially required.  
In addition, even electronic components or functional modules that are used for the general electronic equipment,  
if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliabil-  
ity evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to  
install a protective circuit is strongly recommended at customer's design stage.  
The contents of this catalog are applicable to the products which are purchased from our sales offices or distribu-  
tors (so calledTAIYO YUDENs official sales channel).  
It is only applicable to the products purchased from any of TAIYO YUDENs official sales channel.  
Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may oc-  
cur in connection with a third party's intellectual property rights and other related rights arising from your usage of  
products in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights.  
Caution for export  
Certain items in this catalog may require specific procedures for export according toForeign Exchange and For-  
eign Trade Control Lawof Japan,U.S. Export Administration Regulations, and other applicable regulations.  
Should you have any question or inquiry on this matter, please contact our sales staff.  
notice_e-01  
55125℃  
                                                                         
(BK SERIES)  
MULTILAYER CHIP BEAD INDUCTORS  
WAVE*  
REFLOW  
Except for BK0402, BK0603, BK1005, BKH1005  
FEATURES  
APPLICATIONS  
Internal silver printed layer creates a closed circuit which acts as a  
High frequency noise countermeasure in personal computers, digital  
cameras and other information system products. For use on digital  
product clock lines and general signal lines.  
magnetic shield minimizing heat generation and crosstalk.  
No need for grounding provides greater circuit design flexibility.  
Radiated noise suppression in computer or printer interfaces and har-  
ness connectors.  
Several material types and a broad range of impedance values pro-  
vide noise countermeasures for various applications.  
Noise suppression in video and other AV products.  
HSWith low R-XL cross point frequency characteristics and large  
resistance part working as damping function, suppresses un-  
necessary resonance and keeps signal integrity.  
Prevents interference between circuits in cellular phones PHS, PDC,  
etc.)  
HWWith a lower R-XL cross point frequency characteristics than  
Due to the closed internal circuit which acts as a magnetic shield, the  
TS material is extremely effective as a noise filter on LSI power supply  
lines where downsizing of components is needed.  
those of HS, strongly suppresses unnecessary resonance.  
TS Low DC resistance HS version. For power supply lines .  
HMResistance part rising exceeding from 20MHz. For general us-  
age, especially effective for video signal lines.  
OPERATING TEMP.  
HRResistance part rising exceeding from 10MHz. For general us-  
age, Wider effective range than that of HM.  
LMWith larger impedance set at around 200MHz considering for  
noise regulation.  
LL Resistance part steeply rising exceeding from 100MHz. For high  
speed signal line, good for clock line, sharply cutting noise off.  
The small case size lineup with 01005 inch size.  
ORDERING CODE  
B K 1 6 0 8 H S 1 2 1 T ○  
Type  
Multilayer Chip  
Bead Inductor  
External Dimensions  
L×Wmm〕  
Material  
Impedance〔Ω〕  
example  
150  
Characteristics  
Standard Products  
Packaging  
Tape & Reel  
HW  
HS  
HR  
T
BK  
0402010050.4×0.2  
060302010.6×0.3  
100504021.0×0.5  
160806031.6×0.8  
212508052.0×1.25  
15  
Internal code  
Standard Products  
Multilayer Chip  
Bead Inductor  
101  
102  
100  
BKH  
Refer to impedance  
HM curves for material  
1000  
△=Blank Space  
differences  
LM  
LL  
TS  
EXTERNAL DIMENSIONS/STANDARD QUANTITY  
Standard Quantitypcs]  
Paper Tape Embossed Tape  
Type  
L
W
T
e
0.04  
0.03  
0.10  
BK0402  
0.40±0.02  
0.20±0.02  
0.20±0.02  
20000  
0.002  
01005) (0.016±0.001) (0.008±0.001) (0.008±0.001)  
0.004  
0.001  
BK0603  
0201) (0.024±0.001) (0.012±0.001) (0.012±0.001) (0.006±0.002)  
BK1005 1.00±0.05 0.50±0.05 0.50±0.05 0.25±0.10  
0402) (0.039±0.002) (0.020±0.002) (0.020±0.002) (0.010±0.004)  
BKH1005 1.00±0.05 0.50±0.05 0.50±0.05 0.25±0.10  
0402) (0.039±0.002) (0.020±0.002) (0.020±0.002) (0.010±0.004)  
BK1608  
0.60±0.03  
0.30±0.03  
0.30±0.03  
0.15±0.05  
15000  
10000  
10000  
4000  
4000  
1.6±0.15  
0.8±0.15  
0.8±0.15  
0.3±0.2  
0603) (0.063±0.006) (0.031±0.006) (0.031±0.006) (0.012±0.008)  
0.85±0.2  
0.3  
2.0  
0.033±0.008)  
BK2125  
0805)  
0.1  
1.25±0.2  
0.049±0.008)  
0.5±0.3  
0.020±0.012)  
0.012  
1.25±0.2  
0.049±0.008)  
0.079  
0.004  
2000  
Unitmminch)  
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.  
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.  
mlci07_e-01  
126  
AVAILABLE MATERIALS  
BK0402  
BK0603  
HS type  
HM type  
HS type  
HM type  
200  
800  
700  
600  
500  
400  
300  
200  
100  
300  
250  
200  
150  
100  
50  
1000  
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
180  
160  
140  
120  
100  
80  
1 121  
2 700  
3 100  
1
2
3
4
5
6
HS601  
HS241  
HS121  
HS800  
HS330  
HS220  
1 121  
2 750  
1
1
2
3
4
5
HM601  
HM471  
HM241  
HM121  
HM600  
1
2
2
60  
3
4
3
4
40  
20  
5
5
6
0
0
0
1
10  
100  
1000  
10000  
1
10  
100  
1000  
10000  
Frequency [MHz]  
Frequency [MHz]  
I max=240540mA  
I max=220260mA  
I max=150500mA  
I max=100200mA  
BK1005  
HS type  
HM type  
LL type  
HW type  
1200  
1000  
800  
1600  
1400  
1200  
1000  
800  
1000  
800  
1
2
3
4
5
6
7
8
9
HS102  
HS601  
HS431  
HS241  
HS121  
HS680  
HS800  
HS330  
HS100  
1
HW  
HW  
1
2
3
4
5
6
7
LL121  
LL800  
LL560  
LL470  
LL330  
LL220  
LL100  
700  
500  
300  
HM  
HM  
HM  
HM  
HM  
1
2
3
HW  
HW  
HW  
2
3
600  
400  
200  
0
6 HM750  
600  
600  
400  
4
5
6
7
4
5
400  
200  
6
200  
7
8
9
6
0
1
10  
100  
1000  
10000  
Frequency [MHz]  
I max=100200mA  
I max=300500mA  
I max=3001000mA  
I max=150350mA  
LL type  
LM type  
HR type  
1
BKH type  
2500  
2000  
1500  
1000  
500  
2500  
2000  
1500  
1000  
500  
800  
3000  
2500  
2000  
1500  
1000  
500  
1
1
1
2
3
4
5
6
7
8
LL241  
LL181  
LL121  
LL680  
LL470  
LL330  
LL220  
LL100  
1
HR601  
1
LM182  
1 LM182  
600  
400  
200  
0
1
2 LM152  
2
2
3
4
5
6
7
8
0
0
0
I max=250600mA  
BK1608  
I max=120mA  
HS type  
I max=300mA  
HM type  
I max=200mA  
LL type  
HW type  
2000  
1000  
1
2
3
4
5
6
7
LL241  
LL181  
LL121  
LL680  
LL560  
LL470  
LL300  
HW  
HW  
HW  
HW  
HS  
HS  
HS  
HS  
HM  
1
HM  
HM  
HM  
HM  
2
3
4
5
6
7
0
I max=300600mA  
I max=3001500mA  
I max=200350mA  
I max=250500mA  
LM type  
LL type  
TS type  
LM  
LM  
LM  
LM  
TS  
TS  
TS  
I max=150200mA  
I max=200300mA  
I max=300400mA  
BK2125  
HS type  
HM type  
LL type  
LM type  
HS  
HS  
HS  
HS  
HS  
LL  
LL  
LL  
LM  
LM  
LM  
LM  
HM  
HM  
HM  
HM  
HM  
I max=3001200mA  
I max=400800mA  
I max=300600mA  
I max=200400mA  
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.  
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.  
mlci07_e-01  
127  
PART NUMBERS  
BK0402  
EHSEnvironmental  
Measuring  
frequency  
MHz〕  
Impedance  
〔Ω〕  
DC resistance  
〔Ωmax.)  
Rated current  
mAmax.)  
Thickness  
mminch)  
Ordering code  
Hazardous  
Substances  
BK 0402 HS 100  
BK 0402 HS 700  
BK 0402 HS 121  
BK 0402 HM750  
BK 0402 HM121  
RoHS  
10±5  
0.10  
0.37  
0.53  
0.45  
0.60  
540  
280  
240  
260  
220  
RoHS  
70±25%  
120±25%  
75±25%  
120±25%  
0.20±0.02  
0.008±0.001)  
RoHS  
100  
RoHS  
RoHS  
BK0603  
EHSEnvironmental  
Measuring  
frequency  
MHz〕  
Impedance  
〔Ω〕  
DC resistance  
〔Ωmax.)  
Rated current  
mAmax.)  
Thickness  
mminch)  
Ordering code  
Hazardous  
Substances  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
BK 0603 HS 220  
BK 0603 HS 330  
BK 0603 HS 800  
BK 0603 HS 121  
BK 0603 HS 241  
BK 0603 HS 601  
BK 0603 HM600  
BK 0603 HM121  
BK 0603 HM241  
BK 0603 HM471  
BK 0603 HM601  
BK 0603 LL 100  
BK 0603 LL 220  
BK 0603 LL 330  
BK 0603 LL 470  
BK 0603 LL 560  
BK 0603 LL 800  
BK 0603 LL 121  
22±25%  
33±25%  
80±25%  
120±25%  
240±25%  
600±25%  
60±25%  
120±25%  
240±25%  
470±25%  
600±25%  
10±25%  
22±25%  
33±25%  
47±25%  
56±25%  
80±25%  
120±25%  
0.065  
0.070  
0.40  
0.45  
0.65  
1.20  
0.25  
0.40  
0.80  
1.05  
1.20  
0.25  
0.45  
0.55  
0.70  
1.00  
1.30  
1.50  
500  
500  
200  
200  
200  
150  
200  
200  
200  
100  
100  
200  
200  
150  
150  
100  
100  
100  
0.30±0.03  
0.012±0.001)  
100  
BK1005  
EHSEnvironmental  
Measuring  
frequency  
MHz〕  
Impedance  
〔Ω〕  
DC resistance  
〔Ωmax.)  
Rated current  
mAmax.)  
Thickness  
mminch)  
Ordering code  
Hazardous  
Substances  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
BK 1005 HW680  
BK 1005 HW121  
BK 1005 HW241  
BK 1005 HW431  
BK 1005 HW601  
BK 1005 HS 100  
BK 1005 HS 330  
BK 1005 HS 680  
BK 1005 HS 800  
BK 1005 HS 121  
BK 1005 HS 241  
BK 1005 HS 431  
BK 1005 HS 601  
BK 1005 HS 102  
BK 1005 HR 601  
BK 1005 HM750  
BK 1005 HM121  
BK 1005 HM241  
BK 1005 HM471  
BK 1005 HM601  
BK 1005 HM102  
BK 1005 LL 100  
BK 1005 LL 220  
BK 1005 LL 330  
BK 1005 LL 470  
BK 1005 LL 680  
BK 1005 LL 121  
BK 1005 LL 181  
BK 1005 LL 241  
BK 1005 LM 182  
BKH 1005 LM 152  
BKH 1005 LM 182  
68±25%  
120±25%  
240±25%  
430±25%  
600±25%  
10±5  
33±25%  
68±25%  
80±25%  
120±25%  
240±25%  
430±25%  
600±25%  
1000±25%  
600±25%  
75±25%  
120±25%  
240±25%  
470±25%  
600±25%  
1000±25%  
10±25%  
22±25%  
33±25%  
47±25%  
0.17  
0.24  
0.31  
0.50  
0.60  
0.03  
0.06  
0.10  
0.10  
0.20  
0.30  
0.45  
0.55  
0.58  
0.60  
0.18  
0.18  
0.30  
0.45  
0.50  
0.70  
0.11  
0.18  
0.25  
0.33  
0.31  
0.45  
0.50  
0.70  
0.90  
1.50  
2.00  
500  
450  
400  
350  
300  
1000  
700  
700  
700  
500  
400  
350  
300  
300  
300  
350  
300  
300  
250  
250  
150  
500  
400  
400  
350  
400  
350  
300  
250  
120  
200  
200  
0.50±0.05  
0.020±0.002)  
100  
68±25%  
120±25%  
180±25%  
240±25%  
1800±25%  
1500±25%  
1800±25%  
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.  
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.  
mlci07_e-01  
128  
PART NUMBERS  
BK1608  
EHSEnvironmental  
Measuring  
frequency  
MHz〕  
Impedance  
〔Ω〕  
DC resistance  
〔Ωmax.)  
Rated current  
mAmax.)  
Thickness  
mminch)  
Ordering code  
Hazardous  
Substances  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
BK 1608 HW121  
BK 1608 HW241  
BK 1608 HW431  
BK 1608 HW601  
BK 1608 HS 220  
BK 1608 HS 330  
BK 1608 HS 470  
BK 1608 HS 600  
BK 1608 HS 800  
BK 1608 HS 121  
BK 1608 HS 241  
BK 1608 HS 601  
BK 1608 HS 102  
BK 1608 HM121  
BK 1608 HM241  
BK 1608 HM471  
BK 1608 HM601  
BK 1608 HM102  
BK 1608 LL 300  
BK 1608 LL 470  
BK 1608 LL 560  
BK 1608 LL 680  
BK 1608 LL 121  
BK 1608 LL 181  
BK 1608 LL 241  
BK 1608 LL 331  
BK 1608 LL 431  
BK 1608 LL 511  
BK 1608 LL 681  
BK 1608 LM 751  
BK 1608 LM 152  
BK 1608 LM 182  
BK 1608 LM 252  
BK 1608 TS 431  
BK 1608 TS 601  
BK 1608 TS 102  
120±25%  
240±25%  
430±25%  
600±25%  
22±25%  
33±25%  
47±25%  
60±25%  
80±25%  
120±25%  
240±25%  
600±25%  
1000±25%  
120±25%  
240±25%  
470±25%  
600±25%  
1000±25%  
30±25%  
0.15  
0.25  
600  
450  
400  
300  
1500  
1200  
900  
800  
600  
500  
400  
350  
300  
350  
300  
250  
250  
200  
500  
400  
400  
300  
300  
250  
250  
200  
200  
200  
150  
300  
250  
200  
200  
400  
350  
300  
0.30  
0.40  
0.05  
0.08  
0.10  
0.10  
0.10  
0.18  
0.25  
0.45  
0.60  
0.20  
0.35  
0.45  
0.60  
0.70  
0.80±0.15  
0.031±0.006)  
100  
0.20  
47±25%  
56±25%  
68±25%  
0.30  
0.30  
0.35  
120±25%  
180±25%  
240±25%  
330±25%  
430±25%  
510±25%  
680±25%  
750±25%  
1500±25%  
1800±25%  
2500±25%  
430±25%  
600±25%  
1000±25%  
0.50  
0.65  
0.80  
0.85  
0.85  
0.90  
1.00  
0.60  
0.75  
0.85  
1.10  
0.21±30%  
0.27±30%  
0.30±30%  
BK2125  
EHSEnvironmental  
Hazardous  
Measuring  
frequency  
MHz〕  
Impedance  
〔Ω〕  
DC resistance  
〔Ωmax.)  
Rated current  
mAmax.)  
Thickness  
mminch)  
Ordering code  
Substances)  
BK 2125 HS 150  
BK 2125 HS 220  
BK 2125 HS 330  
BK 2125 HS 470  
BK 2125 HS 750  
BK 2125 HS 101  
BK 2125 HS 121  
BK 2125 HS 241  
BK 2125 HS 431  
BK 2125 HS 601  
BK 2125 HS 102  
BK 2125 HM121  
BK 2125 HM241  
BK 2125 HM471  
BK 2125 HM601  
BK 2125 HM102  
BK 2125 LL 560  
BK 2125 LL 121  
BK 2125 LL 241  
BK 2125 LM 751  
BK 2125 LM 152  
BK 2125 LM 182  
BK 2125 LM 252  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
15±25%  
22±25%  
33±25%  
47±25%  
75±25%  
0.05  
0.05  
0.05  
0.05  
0.10  
0.10  
0.15  
0.20  
0.25  
0.30  
0.40  
0.15  
0.20  
0.25  
0.25  
0.35  
0.20  
0.30  
0.35  
0.30  
0.35  
0.45  
0.75  
1200  
1200  
1200  
1000  
1000  
900  
800  
600  
500  
500  
300  
800  
600  
500  
500  
400  
600  
400  
300  
400  
400  
300  
200  
100±25%  
120±25%  
240±25%  
430±25%  
600±25%  
1000±25%  
120±25%  
240±25%  
470±25%  
600±25%  
1000±25%  
56±25%  
120±25%  
240±25%  
750±25%  
1500±25%  
1800±25%  
2500±25%  
0.85±0.2  
0.033±0.008)  
100  
1.25±0.2  
0.049±0.008)  
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.  
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.  
mlci07_e-01  
129  
ELECTRICAL CHARACTERISTICS  
BK0402  
BK0402 HS100  
100  
BK0402 HS700  
BK0402 HS121  
BK0402 HM750  
250  
200  
150  
100  
50  
250  
200  
150  
100  
50  
300  
250  
200  
150  
100  
50  
80  
60  
40  
20  
0
1000  
1000  
1000  
0
0
0
1
10  
100  
10000  
1
10  
100  
10000  
10000  
10000  
10000  
1
1
1
10  
100  
10000  
10000  
10000  
1
1
1
10  
100  
1000  
10000  
10000  
10000  
Frequency [MHz]  
Frequency [MHz]  
Frequency [MHz]  
Frequency [MHz]  
BK0603  
BK0603 HS220  
BK0402 HM121  
BK0603 HS330  
100  
80  
100  
80  
60  
40  
20  
250  
200  
150  
100  
50  
300  
250  
200  
150  
100  
50  
60  
40  
20  
0
Z
R
R
Z
X
X
1000  
0
0
10  
100  
1000  
1
10  
100  
1
1
1
10  
100  
1000  
1000  
1000  
10000  
10000  
10000  
10  
100  
1000  
Frequency [MHz]  
FrequencyMHz]  
Frequency [MHz]  
BK0603 HS601  
1000  
800  
600  
400  
200  
250  
200  
150  
100  
50  
250  
200  
150  
100  
50  
R
Z
Z
X
X
R
0
10  
100  
1000  
10  
100  
1
10  
100  
1000  
10  
100  
1000  
FrequencyMHz]  
BK0603 HM601  
BK0603 HM241  
BK0603 HM471  
1000  
800  
600  
400  
200  
0
500  
400  
1000  
800  
250  
200  
150  
100  
50  
Z
Z
300  
200  
100  
0
600  
400  
200  
0
Z
R
R
R
X
10  
100  
1
10  
100  
1000  
1
10  
100  
1000  
10000  
FrequencyMHz]  
FrequencyMHz]  
BK0603 LL330  
BK0603 LL100  
BK0603 LL220  
BK0603 LL470  
500  
400  
300  
200  
100  
0
500  
400  
250  
200  
150  
100  
50  
250  
200  
150  
100  
50  
300  
200  
100  
0
Z
R
Z
Z
Z
X
X
X
R
0
0
1
10  
100  
1000  
10000  
1
10  
100  
1000  
10000  
1
10  
100  
1000  
10000  
1
10  
100  
1000  
10000  
FrequencyMHz]  
FrequencyMHz]  
FrequencyMHz]  
FrequencyMHz]  
BK1005  
BK0603 LL560  
Z
BK1005 HW680  
BK0603 LL800  
BK0603 LL121  
500  
400  
250  
200  
1000  
800  
1000  
800  
R
300  
200  
100  
0
150  
100  
50  
600  
400  
200  
0
600  
400  
200  
0
Z
Z
R
Z
R
X
X
X
1000  
0
1
10  
100  
1000  
10000  
1
10  
100  
1000  
10000  
1
10  
100  
10000  
1
10  
100  
1000  
10000  
FrequencyMHz]  
FrequencyMHz]  
FrequencyMHz]  
FrequencyMHz]  
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.  
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.  
mlci07_e-01  
130  
ELECTRICAL CHARACTERISTICS  
BK1005 HW121  
250  
BK1005 HW241  
BK1005 HW431  
BK1005 HW601  
500  
400  
1000  
800  
1000  
800  
200  
150  
300  
200  
100  
0
600  
400  
200  
0
600  
400  
200  
0
Z
100  
Z
Z
R
R
R
50  
X
X
X
0
1
10  
100  
1000  
10000  
1
1
1
10  
100  
1000  
10000  
10000  
10000  
1
10  
100  
1000  
10000  
1
10  
100  
1000  
10000  
FrequencyMHz]  
FrequencyMHz]  
FrequencyMHz]  
FrequencyMHz]  
BK1005 HS800  
BK1005 HS100  
BK1005 HS330  
BK1005 HS680  
250  
200  
100  
80  
100  
80  
250  
200  
150  
100  
50  
60  
40  
20  
0
60  
40  
20  
0
150  
100  
50  
Z
R
R
Z
Z
Z
R
X
X
X
X
0
1
0
10  
100  
1000  
10000  
10  
100  
1000  
1
10  
100  
1000  
10000  
1
10  
100  
1000  
10000  
FrequencyMHz]  
FrequencyMHz]  
FrequencyMHz]  
BK1005 HS431  
250  
200  
150  
100  
50  
1000  
800  
600  
400  
200  
0
Z
R
X
100  
0
10  
1000  
FrequencyMHz]  
BK1005 HR601  
BK1005 HM750  
BK1005 HS102  
BK1005 HM121  
1000  
200  
150  
2000  
250  
200  
800  
600  
400  
Z
150  
100  
50  
100  
R
1000  
Z
50  
0
200  
0
R
X
X
0
0
1
10  
100  
1000  
10000  
1
10  
100  
1000  
10000  
FrequencyMHz]  
FrequencyMHz]  
BK1005 HM102  
2000  
500  
400  
300  
200  
1000  
100  
0
0
1
10  
100  
1000  
10000  
1
10  
100  
1000  
10000  
BK1005 LL220  
BK1005 LL470  
BK1005 LL100  
BK1005 LL330  
250  
250  
500  
500  
400  
300  
400  
300  
200  
200  
150  
100  
200  
150  
200  
100  
50  
0
50  
0
100  
0
100  
0
1
10  
100  
1000  
10000  
1
10  
100  
1000  
10000  
1
10  
100  
1000  
10000  
1
10  
100  
1000  
10000  
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.  
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.  
mlci07_e-01  
131  
ELECTRICAL CHARACTERISTICS  
BK1005 LL680  
500  
400  
300  
200  
100  
0
1
10  
100  
1000  
10000  
BK1608  
BK1005 LM182  
BKH1005 LM152  
BKH1005 LM182  
2500  
2000  
3000  
2500  
2000  
1500  
1000  
500  
3000  
2500  
2000  
1500  
1000  
500  
Z
Z
1500  
1000  
R
Z
R
R
500  
0
X
X
X
0
0
1
10  
100  
1000  
10000  
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.  
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.  
mlci07_e-01  
132  
ELECTRICAL CHARACTERISTICS  
BK1608 LL300  
BK1608 LL470  
BK1608 LL560  
500  
500  
500  
250  
250  
250  
0
0
0
1
10  
100  
1000  
10000  
1
10  
100  
1000  
10000  
1
10  
100  
1000  
10000  
BK1608 LL680  
BK1608 LL121  
500  
1500  
250  
750  
0
0
1
10  
100  
1000  
10000  
1
10  
100  
1000  
4000  
2000  
BK2125  
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.  
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.  
mlci07_e-01  
133  
ELECTRICAL CHARACTERISTICS  
1000  
Z
500  
R
X
0
1
10  
100  
1000  
1000  
500  
Z
R
X
0
1
10  
100  
1000  
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.  
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.  
mlci07_e-01  
134  
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.  
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.  
mlci07_e-01  
135  
PACKAGING  
Minimum Quantity  
Taping material  
Tape & Reel Packaging  
C K  
C K  
C K S 2125  
1608  
2125  
Standard Quantitypcs]  
Paper Tape Embossed Tape  
Thickness  
Type  
mminch)  
L K  
L K  
L K  
H K  
H K  
H K  
H K  
1005  
1608  
2125  
0402  
0603  
1005  
1608  
0.8  
CK16080603)  
4000  
0.031)  
0.85  
4000  
2000  
0.033)  
1.25  
CK21250805)  
CKS21250805)  
0.049)  
0.85  
H K Q 0603  
A Q  
B K  
B K  
B K  
B K  
B K  
B K  
B K P 0603  
B K P 1005  
B K P 1608  
B K P 2125  
B K H 1005  
105  
4000  
0402  
0603  
1005  
1608  
2125  
2010  
0.033)  
1.25  
2000  
3000  
3000  
3000  
3000  
2000  
3000  
2000  
0.049)  
0.9  
CKP20120805)  
CKP20160806)  
0.035)  
0.9  
0.035)  
0.7  
0.028)  
0.9  
CKP25201008)  
C K  
2125  
0.035)  
1.1  
C K S 2125  
C K P 2012  
C K P 2016  
C K P 2520  
N M  
N M  
L K  
H K  
B K  
B K  
0.043)  
0.9  
NM20120805)  
NM25201008)  
LK10050402)  
LK16080603)  
2012  
2520  
2125  
2125  
2125  
3216  
0.035)  
1.1  
0.043)  
0.5  
10000  
4000  
4000  
0.020)  
0.8  
0.031)  
0.85  
0.033)  
1.25  
LK21250805)  
2000  
0.049)  
0.2  
Taping Dimensions  
HK040201005)  
HK06030201)  
HK10050402)  
HK16080603)  
20000  
15000  
10000  
4000  
0.008)  
0.3  
Paper tape (0.315 inches wide)  
0.012)  
0.5  
0.020)  
0.8  
0.031)  
0.85  
4000  
3000  
0.033)  
1.0  
HK21250805)  
0.039)  
0.3  
HKQ0603S0201)  
HKQ0603U0201)  
AQ1050402)  
15000  
15000  
10000  
20000  
15000  
10000  
10000  
4000  
4000  
Unit : mminch)  
0.012)  
0.3  
0.012)  
0.5  
Insertion  
Tape  
Thickness  
Thickness  
Chip cavity  
0.020)  
0.2  
Pitch  
Type  
mm〕  
inch)  
A
B
F
T
BK040201005)  
BK06030201)  
BK10050402)  
BKH10050402)  
BK16080603)  
0.008)  
0.3  
0.8  
1.0±0.2  
1.8±0.2  
4.0±0.1  
1.1ax  
CK16080603)  
CK21250805)  
CKS21250805)  
LK10050402)  
LK16080603)  
LK21250805)  
HK040201005)  
HK06030201)  
HK10050402)  
HK16080603)  
HKQ0603S0201)  
HKQ0603U0201)  
AQ1050402)  
0.0310.039±0.0080.071±0.0080.157±0.004) (0.043max)  
0.012)  
0.5  
0.85  
0.0330.059±0.0080.091±0.0080.157±0.004) (0.043max)  
0.85 1.5±0.2 2.3±0.2 4.0±0.1 1.1ax  
0.0330.059±0.0080.091±0.0080.157±0.004) (0.043max)  
0.5 0.65±0.1 1.15±0.1 2.0±0.05 0.8ax  
0.0200.026±0.0040.045±0.0040.079±0.002) (0.031max)  
0.8 1.0±0.2 1.8±0.2 4.0±0.1 1.1ax  
0.0310.039±0.0080.071±0.0080.157±0.004) (0.043max)  
0.85 1.5±0.2 2.3±0.2 4.0±0.1 1.1ax  
0.0330.059±0.0080.091±0.0080.157±0.004) (0.043max)  
0.2 0.25±0.04 0.45±0.04 2.0±0.05 0.36ax  
0.0080.010±0.0020.018±0.0020.079±0.002) (0.014max)  
0.3 0.40±0.06 0.70±0.06 2.0±0.05 0.45ax  
0.0120.016±0.0020.028±0.0020.079±0.002) (0.018max)  
0.5 0.65±0.1 1.15±0.1 2.0±0.05 0.8ax  
0.0200.026±0.0040.045±0.0040.079±0.002) (0.031max)  
0.8 1.0±0.2 1.8±0.2 4.0±0.1 1.1ax  
0.0310.039±0.0080.071±0.0080.157±0.004) (0.043max)  
0.3 0.40±0.06 0.70±0.06 2.0±0.05 0.45ax  
0.0120.016±0.0020.028±0.0020.079±0.002) (0.018max)  
0.3 0.40±0.06 0.70±0.06 2.0±0.05 0.45ax  
0.0120.016±0.0020.028±0.0020.079±0.002) (0.018max)  
0.5  
1.5±0.2  
2.3±0.2  
4.0±0.1  
1.1ax  
0.020)  
0.5  
0.020)  
0.8  
0.031)  
0.85  
0.033)  
1.25  
BK21250805)  
2000  
0.049)  
0.45  
BK20100804)  
BK32161206)  
BKP06030201)  
BKP10050402)  
BKP16080603)  
BKP21250805)  
4000  
0.018)  
0.8  
4000  
0.031)  
0.3  
15000  
10000  
4000  
4000  
0.012)  
0.5  
0.020)  
0.8  
0.75±0.1  
1.15±0.1  
2.0±0.05  
0.8ax  
0.031)  
0.85  
0.0200.030±0.0040.045±0.0040.079±0.002) (0.031max)  
0.033)  
To next page  
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.  
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.  
mlci0109_reli_e-01  
mlci0109_reli-PRP1  
PACKAGING  
Reel Size  
Insertion  
Pitch  
Tape  
Thickness  
Thickness  
Chip cavity  
Type  
mm〕  
inch)  
A
B
F
T
2.0±0.5  
0.2  
0.25±0.04  
0.45±0.04  
2.0±0.05  
0.36ax  
0.079±0.031)  
BK040201005)  
BK06030201)  
BK10050402)  
BK16080603)  
BK21250805)  
BK20100804)  
BKP06030201)  
BKP10050402)  
BKP1608 0603)  
BKP21250805)  
BKH1005 0805)  
0.0080.010±0.0020.018±0.0020.079±0.002) (0.014max)  
φ13.0±0.2  
0.3  
0.0120.016±0.0020.028±0.0020.079±0.002) (0.018max)  
0.5 0.65±0.1 1.15±0.1 2.0±0.05 0.8ax  
0.0200.026±0.0040.045±0.0040.079±0.002) (0.031max)  
0.8 1.0±0.2 1.8±0.2 4.0±0.1 1.1ax  
0.0310.039±0.0080.071±0.0080.157±0.004) (0.043max)  
0.85 1.5±0.2 2.3±0.2 4.0±0.1 1.1ax  
0.0330.059±0.0080.091±0.0080.157±0.004) (0.043max)  
0.45 1.2±0.1 2.17±0.1 4.0±0.1 0.8ax  
0.0180.047±0.0040.085±0.0040.157±0.004) (0.031max)  
0.3 0.40±0.06 0.70±0.06 2.0±0.05 0.45ax  
0.0120.016±0.0020.028±0.0020.079±0.002) (0.018max)  
0.5 0.65±0.1 1.15±0.1 2.0±0.05 0.8ax  
0.0200.026±0.0040.045±0.0040.079±0.002) (0.031max)  
0.8 1.0±0.2 1.8±0.2 4.0±0.1 1.1ax  
0.0310.039±0.0080.071±0.0080.157±0.004) (0.043max)  
0.85 1.5±0.2 2.3±0.2 4.0±0.1 1.1ax  
0.0330.059±0.0080.091±0.0080.157±0.004) (0.043max)  
0.5  
0.40±0.06  
0.70±0.06  
2.0±0.05  
0.45ax  
(φ0.512±0.020)  
Top tape strength  
The top tape requires a peel-off force of 0.10.7N in the direction of the arrow as  
0.65±0.1  
1.15±0.1  
2.0±0.05  
0.8ax  
illustrated below.  
0.0200.026±0.0040.045±0.0040.079±0.002) (0.031max)  
Unit : mminch)  
Embossed Tape (0.315 inches wide)  
Unit : mminch)  
Insertion  
Pitch  
Tape  
Thickness  
Thickness  
mm〕  
inch)  
Chip cavity  
Type  
A
B
F
K
T
1.25  
1.5±0.2  
2.3±0.2  
4.0±0.1  
2.0  
0.3  
CK21250805)  
CKS21250805)  
CKP20120805)  
CKP20160806)  
0.049) (0.059±0.008) (0.091±0.008) (0.157±0.004) (0.0790.012)  
1.25  
0.049) (0.059±0.008) (0.091±0.008) (0.157±0.004) (0.0790.012)  
0.9 1.55±0.2 2.3±0.2 4.0±0.1 1.3 0.3  
0.035) (0.061±0.008) (0.091±0.008) (0.157±0.004) (0.0510.012)  
0.9 1.8±0.1 2.2±0.1 4.0±0.1 1.3 0.25  
0.035) (0.071±0.004) (0.087±0.004) (0.157±0.004) (0.051) (0.01)  
1.5±0.2  
2.3±0.2  
4.0±0.1  
2.0  
0.3  
0.7  
1.4  
0.028)  
0.055)  
0.9  
2.3±0.1  
2.8±0.1  
4.0±0.1  
1.4  
0.3  
CKP25201008)  
0.035) (0.091±0.004) (0.110±0.004) (0.157±0.004) (0.055)(0.012)  
1.1  
1.7  
0.043)  
0.067)  
0.9  
1.55±0.2  
2.3±0.2  
4.0±0.1  
1.3  
0.3  
NM20120805)  
NM25201008)  
LK21250805)  
0.035) (0.061±0.008) (0.091±0.008) (0.157±0.004) (0.0510.012)  
1.1 2.3±0.1 2.8±0.1 4.0±0.1 1.7 0.3  
0.043) (0.091±0.004) (0.110±0.004) (0.157±0.004) (0.067)(0.012)  
1.25 1.5±0.2 2.3±0.2 4.0±0.1 2.0 0.3  
0.049) (0.059±0.008) (0.091±0.008) (0.157±0.004) (0.0790.012)  
0.85  
1.5  
0.033)  
1.0  
0.059)  
2.0  
1.5±0.2  
2.3±0.2  
4.0±0.1  
0.3  
0.012)  
HK21250805)  
0.059±0.008) (0.091±0.008) (0.157±0.004)  
0.039)  
0.079)  
1.25  
1.5±0.2  
2.3±0.2  
4.0±0.1  
2.0  
0.3  
BK21250805)  
BK32161206)  
0.049) (0.059±0.008) (0.091±0.008) (0.157±0.004) (0.0790.012)  
0.8 1.9±0.1 3.5±0.1 4.0±0.1 1.4 0.3  
0.031) (0.075±0.004) (0.138±0.004) (0.157±0.004) (0.055)(0.012)  
LEADER AND BLANK PORTION  
160mm or more  
100mm or more  
6.3inches or more  
3.94inches or more)  
400mm ore more  
Direction of tape feed  
15.7inches or more)  
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.  
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.  
mlci0109_reli_e-01  
mlci0109_reli-PRP2  
RELIABILITY DATA  
Multilayer chip inductors and beads  
1. Operating Temperature Range  
BK0402  
BK0603  
BK1005  
BKH1005  
BK1608  
BK2125  
55~+125℃  
55~+85℃  
BK2010  
ARRAY  
BK3216  
BKP0603  
BKP1005  
BKP1608  
BKP2125  
CK1608  
CK2125  
CKS2125  
CKP2012  
CKP2016  
CKP2520  
NM2012  
NM2520  
LK1005  
40~+85℃  
LK1608  
LK2125  
HK0402  
HK0603  
HK1005  
HK1608  
HK2125  
HKQ0603S  
HKQ0603U  
AQ105  
55~+125℃  
40~+85℃  
55~+125℃  
2. Storage Temperature Range  
BK0402  
BK0603  
BK1005  
BKH1005  
BK1608  
BK2125  
55~+125℃  
55~+85℃  
BK2010  
ARRAY  
BK3216  
BKP0603  
BKP1005  
BKP1608  
BKP2125  
CK1608  
CK2125  
CKS2125  
CKP2012  
CKP2016  
CKP2520  
NM2012  
NM2520  
LK1005  
40~+85℃  
LK1608  
LK2125  
HK0402  
HK0603  
HK1005  
HK1608  
HK2125  
HKQ0603S  
HKQ0603U  
AQ105  
55~+125℃  
40~+85℃  
55~+125℃  
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.  
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.  
mlci0109_reli_e-01  
mlci0109_reli-PRP3  
RELIABILITY DATA  
Multilayer chip inductors and beads  
3. Rated Current  
BK0402  
240540mA DC  
100500mA C  
1201000mA C  
200mA C  
1501500mA C  
2001200mA C  
100mA C  
BK0603  
BK1005  
BKH1005  
BK1608  
BK2125  
BK2010  
ARRAY  
BK3216  
100200mA C  
1.0A C  
BKP0603  
BKP1005  
BKP1608  
BKP2125  
CK1608  
CK2125  
CKS2125  
CKP2012  
CKP2016  
CKP2520  
NM2012  
NM2520  
LK1005  
8002000mA DC  
1.03.0A C  
1.54.0A C  
5060mA DC  
60500mA DC  
110280mA DC  
0.71.2A DC  
0.91.6A DC  
1.11.8A DC  
0.81.5A DC  
0.91.1A DC  
2025mA DC  
1150mA DC  
5300mA DC  
160380mA DC  
60470mA DC  
110300mA DC  
150300mA DC  
300mA DC  
LK1608  
LK2125  
HK0402  
HK0603  
HK1005  
HK1608  
HK2125  
HKQ0603S  
HKQ0603U  
AQ105  
130600mA DC  
130600mA DC  
280710mA DC  
Definition of rated current:  
In the CK, CKS and BK Series, the rated current is the value of current at which the temperature of the element is increased within 20.  
In the BK Series P type and CK Series P type, NM Series the rated current is the value of current at which the temperature of the element is increased within 40.  
In the LK,HK,HKQ,and AQ Series, the rated current is either the DC value at which the internal L value is decreased within 5% with the application of DC bias, or the value of current  
at which the temperature of the element is increased within 20.  
4. Impedance  
BK0402  
BK0603  
BK1005  
BKH1005  
BK1608  
BK2125  
10120Ω ±25%  
10600Ω ±25%  
101800Ω ±25%  
15001800Ω ±25%  
222500Ω ±25%  
152500Ω ±25%  
51000Ω ±25%  
681000Ω ±25%  
2233Ω ±25%  
BK2010  
BK3216  
ARRAY  
BKP0603  
BKP1005  
BKP1608  
BKP2125  
CK1608  
CK2125  
CKS2125  
CKP2012  
CKP2016  
CKP2520  
NM2012  
NM2520  
LK1005  
10220Ω ±25%  
33470Ω ±25%  
33330Ω ±25%  
LK1608  
——  
LK2125  
HK0402  
HK0603  
HK1005  
HK1608  
HK2125  
HKQ0603S  
HKQ0603U  
AQ105  
Test Methods and Remarks】  
BK0402 Series  
Measuring frequency100±1MHz  
Measuring equipmentE4991Aor its equivalent)  
Measuring jig16196Dor its equivalent)  
BK0603 Series, BKP0603 Series  
BK16082125 Series, BKP16082125 Series  
Measuring frequency100±1MHz  
Measuring equipment4291Aor its equivalent, 4195Aor its equivalent)  
Measuring jig16092Aor its equivalentor 16192Aor its equivalent/HW  
BK20103216 Series  
Measuring frequency100±1MHz  
Measuring equipment4291Aor its equivalent, 4195Aor its equivalent)  
Measuring jig16192Aor its equivalent)  
Measuring frequency100±1MHz  
Measuring equipment4291Aor its equivalent)  
Measuring jig16193Aor its equivalent)  
BK1005 Series, BKP1005 Series, BKH1005 Series  
Measuring frequency100±1MHz  
Measuring equipment4291Aor its equivalent)  
Measuring jig16192Aor its equivalent, 16193Aor its equivalent)  
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.  
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.  
mlci0109_reli_e-01  
mlci0109_reli-PRP4  
RELIABILITY DATA  
Multilayer chip inductors and beads  
5. Inductance  
BK0402  
BK0603  
BK1005  
BKH1005  
BK1608  
BK2125  
——  
BK2010  
ARRAY  
BK3216  
BKP0603  
BKP1005  
BKP1608  
BKP2125  
CK1608  
CK2125  
CKS2125  
CKP2012  
CKP2016  
CKP2520  
NM2012  
NM2520  
LK1005  
4.710.0μH±20%  
0.110.0μH±20%  
1.010.0μH±20%  
0.474.7μH±20%  
0.474.7μH±20%  
0.474.7μH±20%  
0.821.0μH±20%  
1.02.2μH±20%  
0.122.2μH±10%Q 0.122.2μH±30%  
LK1608  
0.04733.0μH±20%0.1012.0μH±10%Q 0.122.2μH±30%  
0.04733.0μH±20%0.1012.0μH±10%Q 0.122.2μH±30%  
1.06.2nH±0.3nH6.812nH±5%  
1.06.2nH±0.3nH6.8100nH±5%  
1.06.2nH±0.3nH6.8270nH±5%  
1.05.6nH±0.3nH6.8470nH±5%  
1.55.6nH±0.3nH6.8470nH±5%  
0.66.2nH±0.3nH6.822nH±5%  
0.66.2nH±0.3nH6.822nH±5%  
LK2125  
HK0402  
HK0603  
HK1005  
HK1608  
HK2125  
HKQ0603S  
HKQ0603U  
AQ105  
1.06.2nH±0.3nH6.815nH±5%  
Test Methods and Remarks】  
CK Series:  
Measuring frequency2 to 4MHzCK1608)  
Measuring frequency2 to 25MHzCK2125)  
Measuring frequency2 to 10MHzCKS2125)  
LK Series:  
Measuring frequency10 to 25MHzLK1005)  
Measuring frequency1 to 50MHzLK1608)  
Measuring frequency0.4 to 50MHzLK2125)  
CKP Series, NM Series:  
Measuring frequency1MHz CKP2012, CKP2016, CKP2520, NM2012NM2520)  
Measuring equipment, jig4194A16085B16092Aor its equivalent)  
4195A4195116092Aor its equivalent)  
4294A16192Aor its equivalent)  
4291A16193Aor its equivalent/LK1005  
4285A42841A42842C4285161100CKP2012CKP2016CKP2520NM2012NM2520)  
Measuring current1mA rms 0.047 to 4.7μH 0.1mA rms 5.6 to 33μH)  
HKHKQAQ Series:  
Measuring frequency100MHz HK0402HK0603HK1005AQ105)  
Measuring frequency50/100MHz HK1608HK2125)  
Measuring frequency500MHz HKQ0603SHKQ0603U)  
Measuring equipment, jig4291A16197Aor its equivalent/HK0603AQ105  
4291A16193Aor its equivalent/HK1005  
E4991A16197Aor its equivalent/HKQ0603SHKQ0603U  
4291A16092in-house made jigor its equivalent/HK1608HK2125  
E4991A16196Dor its equivalent/HK0402  
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.  
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.  
mlci0109_reli_e-01  
mlci0109_reli-PRP5  
RELIABILITY DATA  
Multilayer chip inductors and beads  
6. Q  
BK0402  
BK0603  
BK1005  
BKH1005  
BK1608  
BK2125  
——  
BK2010  
ARRAY  
BK3216  
BKP0603  
BKP1005  
BKP1608  
BKP2125  
CK1608  
CK2125  
CKS2125  
CKP2012  
CKP2016  
CKP2520  
NM2012  
NM2520  
LK1005  
20 min.  
1520 min.  
——  
1020 min.  
1035 min.  
1550 min.  
3 min.  
LK1608  
LK2125  
HK0402  
HK0603  
HK1005  
HK1608  
HK2125  
HKQ0603S  
HKQ0603U  
AQ105  
45 min.  
8 min.  
812 min.  
1018 min.  
1013 min.  
1013 min.  
8 min.  
Test Methods and Remarks】  
HKHKQAQ Series:  
CK Series:  
Measuring frequency100MHz HK0603HK1005AQ105)  
Measuring frequency50/100MHz HK1608HK2125)  
Measuring frequency2 to 4MHz CK1608)  
Measuring frequency2 to 25MHz CK2125)  
LK Series:  
Measuring frequency10 to 25MHz LK1005)  
Measuring frequency1 to 50MHz LK1608)  
Measuring frequency0.4 to 50MHz LK2125)  
Measuring frequency500MHz HKQ0603SHKQ0603U)  
Measuring equipment, jig4291A16197Aor its equivalent/HK0603AQ105  
4291A16193Aor its equivalent/HK1005  
E4991A16197Aor its equivalent/HKQ0603S  
HKQ0603U  
4291A16092Ain-house made jigor its  
equivalent/HK1608HK2125  
E4991A16196Dor its equivalentHK0402  
Measuring equipment, jig4194A16085B16092Aor its equivalent)  
4195A4195116092Aor its equivalent)  
4294A16192Aor its equivalent)  
4291A16193Aor its equivalent/LK1005  
Measuring current1mA rms 0.047 to 4.7μH 0.1mA rms 5.6 to 33μH)  
7. DC Resistance  
BK0402  
BK0603  
BK1005  
BKH1005  
BK1608  
BK2125  
0.100.53Ω max.  
0.0651.50Ω max.  
0.030.80Ω max.  
1.502.00Ω max.  
0.051.10Ω max.  
0.050.75Ω max.  
0.100.90Ω max.  
0.150.80Ω max.  
0.0650.070Ω max.  
0.0300.20Ω max.  
0.0250.18Ω max.  
0.0200.075Ω max.  
0.450.85Ω±30%)  
0.160.65Ω max.  
0.090.40Ω typ.  
0.120.52Ω max.  
0.100.28Ω max.  
0.080.20Ω max.  
0.050.16Ω max.  
0.100.19Ω max.  
0.130.22Ω max.  
0.411.16Ω max.  
0.22.2Ω max.  
BK2010  
BK3216  
ARRAY  
BKP0603  
BKP1005  
BKP1608  
BKP2125  
CK1608  
CK2125  
CKS2125  
CKP2012  
CKP2016  
CKP2520  
NM2012  
NM2520  
LK1005  
LK1608  
LK2125  
HK0402  
HK0603  
HK1005  
HK1608  
HK2125  
0.11.1Ω max.  
0.180.99Ω max.  
0.113.74Ω max.  
0.084.8Ω max.  
0.052.6Ω max.  
0.101.5Ω max.  
0.061.29Ω max.  
0.061.29Ω max.  
0.070.45Ω max.  
HKQ0603S  
HKQ0603U  
AQ105  
Test Methods and Remarks】  
Measuring equipmentVOAC-7412made by Iwasaki Tsushinki VOAC-7512made by Iwasaki Tsushinki)  
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.  
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.  
mlci0109_reli_e-01  
mlci0109_reli-PRP6  
RELIABILITY DATA  
Multilayer chip inductors and beads  
8. Self Resonance Frequency SRF)  
BK0402  
BK0603  
BK1005  
BKH1005  
BK1608  
BK2125  
——  
BK2010  
ARRAY  
BK3216  
BKP0603  
BKP1005  
BKP1608  
BKP2125  
CK1608  
CK2125  
CKS2125  
CKP2012  
CKP2016  
CKP2520  
NM2012  
NM2520  
LK1005  
1725MHz min.  
24235MHz min.  
——  
40180MHz min.  
LK1608  
9260MHz min.  
LK2125  
13320MHz min.  
HK0402  
HK0603  
HK1005  
HK1608  
HK2125  
HKQ0603S  
HKQ0603U  
AQ105  
2900010000MHz min.  
90010000MHz min.  
40010000MHz min.  
30010000MHz min.  
2004000MHz min.  
190010000MHmin.  
190010000MHmin.  
230010000MHz min.  
Test Methods and Remarks】  
LK Series:  
Measuring equipment4195Aor its equivalent)  
Measuring jig4195116092Aor its equivalent)  
HKHKQAQ Series:  
Measuring equipment8719Cor its equivalent8753Dor its equivalent/HK2125  
9. Temperature Characteristic  
BK0402  
BK0603  
BK1005  
BKH1005  
BK1608  
BK2125  
BK2010  
ARRAY  
BK3216  
BKP0603  
BKP1005  
BKP1608  
BKP2125  
CK1608  
CK2125  
CKS2125  
CKP2012  
CKP2016  
CKP2520  
NM2012  
NM2520  
LK1005  
——  
LK1608  
LK2125  
HK0402  
HK0603  
HK1005  
HK1608  
Inductance changeWithin ±10%  
HK2125  
HKQ0603S  
HKQ0603U  
AQ105  
Test Methods and Remarks】  
HKHKQAQ SeriesTemperature range30 to 85℃  
Reference temperature20℃  
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.  
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.  
mlci0109_reli_e-01  
mlci0109_reli-PRP7  
RELIABILITY DATA  
Multilayer chip inductors and beads  
10. Resistance to Flexure of Substrate  
BK0402  
BK0603  
BK1005  
BKH1005  
BK1608  
BK2125  
BK2010  
ARRAY  
BK3216  
BKP0603  
BKP1005  
BKP1608  
BKP2125  
CK1608  
CK2125  
CKS2125  
CKP2012  
CKP2016  
CKP2520  
NM2012  
No mechanical damage.  
NM2520  
LK1005  
LK1608  
LK2125  
HK0402  
HK0603  
HK1005  
HK1608  
HK2125  
HKQ0603S  
HKQ0603U  
AQ105  
Test Methods and Remarks】  
Warp2mmBK Series without 0402size, BKP, BKH, CK, CKS, CKP, NM, LK, HK, HKQ, AQ Series)  
1mmBK0402, HK0402 Series)  
Testing boardglass epoxy-resin substrate  
Thickness0.8mm  
11. Solderability  
BK0402  
BK0603  
BK1005  
BKH1005  
BK1608  
BK2125  
At least 75of terminal electrode is covered by new solder.  
BK2010  
ARRAY  
BK3216  
BKP0603  
BKP1005  
BKP1608  
BKP2125  
CK1608  
CK2125  
CKS2125  
CKP2012  
CKP2016  
CKP2520  
NM2012  
NM2520  
LK1005  
LK1608  
At least 75of terminal electrode is covered by new solder.  
LK2125  
HK0402  
HK0603  
HK1005  
HK1608  
HK2125  
HKQ0603S  
HKQ0603U  
AQ105  
Test Methods and Remarks】  
Solder temperature230±5℃  
Duration4±1 sec.  
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.  
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.  
mlci0109_reli_e-01  
mlci0109_reli-PRP8  
RELIABILITY DATA  
Multilayer chip inductors and beads  
12. Resistance to Soldering  
BK0402  
BK0603  
BK1005  
BKH1005  
BK1608  
BK2125  
AppearanceNo significant abnormality.  
Impedance changeWithin ±30%  
BK2010  
ARRAY  
BK3216  
BKP0603  
BKP1005  
BKP1608  
BKP2125  
CK1608  
CK2125  
CKS2125  
CKP2012  
CKP2016  
CKP2520  
NM2012  
NM2520  
LK1005  
No mechanical damage.  
Remaining terminal electrode70min.  
Inductance change  
R104R7 Within ±10%  
6R8100 Within ±15%  
CKS2125 Within ±20%  
CKP2012CKP2016CKP2520NM2012NM2520Within ±30%  
No mechanical damage.Remaining terminal electrode70min.Inductance changeWithin ±15%  
LK1608  
No mechanical damage.  
Remaining terminal electrode70min.Inductance change47N4R7Within ±10%ꢀ 5R6330Within ±15%  
LK2125  
HK0402  
HK0603  
HK1005  
HK1608  
HK2125  
HKQ0603S  
HKQ0603U  
AQ105  
No mechanical damage.  
Remaining terminal electrode70min.Inductance changeWithin ±5%  
Test Methods and Remarks】  
Solder temperature260±5℃  
Duration10±0.5 sec.  
Preheating temperature150 to 180℃  
Preheating time3 min.  
FluxImmersion into methanol solution with colophony for 3 to 5 sec.  
Recovery2 to 3 hrs of recovery under the standard condition after the test. See Note 1)  
13. Thermal Shock  
BK0402  
BK0603  
BK1005  
BKH1005  
BK1608  
BK2125  
AppearanceNo significant abnormality.  
Impedance changeWithin ±30%  
BK2010  
BK3216  
ARRAY  
BKP0603  
BKP1005  
BKP1608  
BKP2125  
CK1608  
CK2125  
CKS2125  
CKP2012  
CKP2016  
CKP2520  
NM2012  
NM2520  
LK1005  
No mechanical damage.  
Inductance changeWithin ±20%ꢀ Q changeWithin ±30%  
Inductance changeWithin ±20CKS2125)  
No mechanical damage.Inductance changeWithin ±30%  
No mechanical damage.  
Inductance changeWithin ±10%ꢀ Q changeWithin ±30%  
LK1608  
LK2125  
HK0402  
HK0603  
HK1005  
HK1608  
HK2125  
No mechanical damage.  
Inductance changeWithin ±10%ꢀ Q changeWithin ±20%  
HKQ0603S  
HKQ0603U  
AQ105  
Test Methods and Remarks】  
Conditions for 1 cycle  
Step 1Minimum operating temperature  
0  
3  
30±3 min.  
Step 2Room temperature 2 to 3 min.  
3  
0  
Step 3Maximum operating temperature  
Step 4Room temperature 2 to 3 min.  
Number of cycles5  
30±3 min.  
Recovery2 to 3 hrs of recovery under the standard condition after the test. See Note 1)  
(Note 1) When there are questions concerning mesurement resultmeasurement shall be made after 48±2 hrs of recovery under the standard condition.  
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.  
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.  
mlci0109_reli_e-01  
mlci0109_reli-PRP9  
RELIABILITY DATA  
Multilayer chip inductors and beads  
14. Damp HeatSteady state)  
BK0402  
BK0603  
BK1005  
BKH1005  
BK1608  
BK2125  
AppearanceNo significant abnormality.  
Impedance changeWithin ±30%  
BK2010  
ARRAY  
BK3216  
BKP0603  
BKP1005  
BKP1608  
BKP2125  
CK1608  
CK2125  
CKS2125  
CKP2012  
CKP2016  
CKP2520  
NM2012  
NM2520  
LK1005  
No mechanical damage.  
Inductance changeWithin ±20%ꢀ Q changeWithin ±30%  
Inductance changeWithin ±20%  
No mechanical damage.Inductance changeWithin ±30%  
No mechanical damage.  
Inductance changeWithin ±10%ꢀ Q changeWithin ±30%  
LK1608  
LK2125  
No mechanical damage.Inductance changeWithin ±20%ꢀ Q changeWithin ±30%  
HK0402  
HK0603  
HK1005  
HK1608  
HK2125  
HKQ0603S  
HKQ0603U  
AQ105  
No mechanical damage.  
Inductance changeWithin ±10%ꢀ Q changeWithin ±20%  
Test Methods and Remarks】  
BK, BKP, BKH Series:  
Temperature40±2℃  
Humidity90 to 95RH  
24  
Duration500  
hrs  
0  
Recovery2 to 3 hrs of recovery under the standard condition after the removal from test chamber. See Note 1)  
LKCKCKSCKPNMHKHKQAQ Series:  
Temperature40±2LKCKCKSCKPNM Series)  
60±2HKHKQAQ Series)  
Humidity90 to 95RH  
Duration500±12 hrs  
Recovery2 to 3 hrs of recovery under the standard condition after the removal from test chamber. See Note 1)  
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.  
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.  
mlci0109_reli_e-01  
mlci0109_reli-PRP10  
RELIABILITY DATA  
Multilayer chip inductors and beads  
15. Loading under Damp Heat  
BK0402  
BK0603  
BK1005  
BKH1005  
BK1608  
BK2125  
AppearanceNo significant abnormality.  
Impedance changeWithin ±30%  
BK2010  
ARRAY  
BK3216  
BKP0603  
BKP1005  
BKP1608  
BKP2125  
CK1608  
No mechanical damage.  
Inductance changeWithin ±20%ꢀ Q changeWithin ±30%  
CK2125  
CKS2125  
CKP2012  
CKP2016  
CKP2520  
NM2012  
NM2520  
LK1005  
No mechanical damage.Inductance changeWithin ±20%  
No mechanical damage.Inductance changeWithin ±30%  
No mechanical damage.Inductance changeWithin ±10%ꢀ Q changeWithin ±30%  
No mechanical damage.  
LK1608  
Inductance change0.047 to 12.0μHWithin ±10%ꢀ 15.0 to 33.0μHWithin ±15%ꢀ Q changeWithin ±30%  
LK2125  
No mechanical damage.Inductance changeWithin ±20%ꢀ Q changeWithin ±30%  
HK0402  
HK0603  
HK1005  
HK1608  
HK2125  
HKQ0603S  
HKQ0603U  
AQ105  
No mechanical damage.  
Inductance changeWithin ±10%ꢀ Q changeWithin ±20%  
Test Methods and Remarks】  
BK, BKP, BKH Series:  
Temperature40±2℃  
Humidity90 to 95RH  
Applied currentRated current  
24  
Duration500  
hrs  
0  
Recovery2 to 3 hrs of recovery under the standard condition after the removal from test chamber. See Note 1)  
LKCKCKSCKPNMHKHKQAQ Series:  
Temperature40±2LKCKCKSCKPNM Series)  
60±2HKHKQAQ Series)  
Humidity90 to 95RH  
Applied currentRated current  
Duration500±12 hrs  
Recovery2 to 3 hrs of recovery under the standard condition after the removal from test chamber. See Note 1)  
Note on standard condition: "standard condition" referred to herein is defined as follows:  
5 to 35of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.  
When there are questions concerning measurement results:  
In order to provide correlation data, the test shall be conducted under condition of 20±2of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air pressure.  
Unless otherwise specified, all the tests are conducted under the "standard condition."  
(Note 1) Measurement shall be made after 48±2 hrs of recovery under the standard condition.  
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.  
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.  
mlci0109_reli_e-01  
mlci0109_reli-PRP11  
RELIABILITY DATA  
Multilayer chip inductors and beads  
16. Loading at High Temperature  
BK0402  
BK0603  
BK1005  
BKH1005  
BK1608  
BK2125  
AppearanceNo significant abnormality  
Impedance changeWithin ±30%  
BK2010  
ARRAY  
BK3216  
BKP0603  
BKP1005  
BKP1608  
BKP2125  
CK1608  
No mechanical damage.  
Inductance changeWithin ±20%ꢀ Q changeWithin ±30%  
CK2125  
CKS2125  
CKP2012  
CKP2016  
CKP2520  
NM2012  
NM2520  
LK1005  
No mechanical damage.Inductance changeWithin ±20%  
No mechanical damage.Inductance changeWithin ±30%  
No mechanical damage.Inductance changeWithin ±10%ꢀ Q changeWithin ±30%  
No mechanical damage.  
LK1608  
Inductance change0.047 to 12.0μHWithin ±10%ꢀ 15.0 to 33.0μHWithin ±15%ꢀ Q changeWithin ±30%  
LK2125  
No mechanical damage.Inductance changeWithin ±20%ꢀ Q changeWithin ±30%  
HK0402  
HK0603  
HK1005  
HK1608  
HK2125  
HKQ0603S  
HKQ0603U  
AQ105  
No mechanical damage.  
Inductance changeWithin ±10%ꢀ Q changeWithin ±20%  
Test Methods and Remarks】  
BK, BKH Series:  
Temperature125±3℃  
Applied currentRated current  
24  
Duration500  
hrs  
0  
Recovery2 to 3 hrs of recovery under the standard condition after the removal from test chamber. See Note 1)  
LKCKCKSCKPNMHKHKQAQBKP Series:  
Temperature85±2LKCKCKSCKPNMBKP Series)  
85±2HK16082125)  
85±2HK1005, AQ105 operating temperature range 55 to 85℃)  
125±2HK0402, HK0603, HK1005, HKQ0603S, HKQ0603U, AQ105 operating temperature range 55 to 125℃)  
Applied currentRated current  
Duration500±12 hrs  
Recovery2 to 3 hrs of recovery under the standard condition after the test. See Note 1)  
Note on standard condition: "standard condition" referred to herein is defined as follows:  
5 to 35of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.  
When there are questions concerning measurement results:  
In order to provide correlation data, the test shall be conducted under condition of 20±2of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air pressure. Unless other-  
wise specified, all the tests are conducted under the "standard condition."  
(Note 1) Measurement shall be made after 48±2 hrs of recovery under the standard condition.  
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.  
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.  
mlci0109_reli_e-01  
mlci0109_reli-PRP12  
PRECAUTIONS  
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer chip bead Inductors  
1. Circuit Design  
Verification of operating environment, electrical rating and performance  
1. A malfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe social ramifications.  
As such, any inductors to be used in such equipment may require higher safety and/or reliability considerations and should be clearly differentiated from  
Precautions  
components used in general purpose applications.  
Operating CurrentVerification of Rated current)  
1. The operating current for inductors must always be lower than their rated values.  
2. Do not apply current in excess of the rated value because the inductance may be reduced due to the magnetic saturation effect.  
2. PCB Design  
Pattern configurations Design of Land-patterns)  
1. When inductors are mounted on a PCB, the size of land patterns and the amount of solder usedsize of filletcan directly affect inductor performance.  
Therefore, the following items must be carefully considered in the design of solder land patterns:  
1The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or cracking. Therefore, when  
designing land-patterns it is necessary to consider the appropriate size and configuration of the solder pads which in turn determines the amount of  
solder necessary to form the fillets.  
2When more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's soldering point is separated  
Precautions  
by solder-resist.  
3The larger size of land patterns and amount of solder, the smaller Q value after mounting on PCB. It makes higher the Q value to design land patterns  
smaller than terminal electrode of chips.  
Pattern configurations Inductor layout on panelizedbreakawayPC boards)  
1. After inductors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufacturing processesPCB cutting,  
board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reflow soldered boards etc.For this reason, planning pattern  
configurations and the position of SMD inductors should be carefully performed to minimize stress.  
Pattern configurations Design of Land-patterns)  
1. The following diagrams and tables show some examples of recommended patterns to prevent excessive solder amounts larger fillets which extend above  
the component end terminations. Examples of improper pattern designs are also shown.  
1Recommended land dimensions for a typical chip inductor land patterns for PCBs  
Recommended land dimensions for wave-soldering  
Recommended land dimensions for reflow-soldering  
Type  
L
1608  
1.6  
2125  
2.0  
3216  
3.2  
Type  
L
0402  
0.4  
0603  
0.6  
1005  
1.0  
105  
1.0  
0.6  
1608  
1.6  
2012  
2.0  
2125  
2.0  
2016  
2.0  
3216  
3.2  
2520  
2.5  
W
A
0.8  
1.25  
1.6  
W
A
0.2  
0.3  
0.5  
0.8  
1.25  
1.25  
1.6  
1.6  
2.0  
0.81.0 1.01.4 1.82.5  
0.50.8 0.81.5 0.81.7  
0.60.8 0.91.2 1.21.6  
Unitmm)  
0.150.25 0.200.30 0.450.55 0.500.55 0.81.0 0.81.2 0.81.2 0.81.2 1.82.5 1.01.4  
0.100.20 0.200.30 0.400.50 0.300.40 0.60.8 0.81.2 0.81.2 0.81.2 0.61.5 0.61.0  
0.150.30 0.250.40 0.450.55 0.600.70 0.60.8 0.91.6 0.91.6 1.22.0 1.22.0 1.82.2  
Unitmm)  
B
B
C
C
Excess solder can affect the ability of chips to withstand mechanical stresses. Therefore, please take proper precautions when designing land-patterns.  
Recommended land dimension for Reflow-soldering  
Type  
L
3216  
3.2  
2010  
2.0  
W
a
1.6  
1.0  
0.70.9 0.50.6  
0.81.0 0.50.6  
0.40.5 0.20.3  
Technical  
consider-  
ations  
b
c
d
0.8  
0.5  
Unitmm)  
2Examples of good and bad solder application  
Item  
Not recommended  
Recommended  
Mixed mounting of SMD  
and leaded components  
Component placement  
close to the chassis  
Hand-soldering of leaded  
components near mounted  
components  
Horizontal component  
placement  
To next page  
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.  
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.  
mlci0109_reli_e-01  
mlci0109_reli-PRP13  
PRECAUTIONS  
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer chip bead Inductors  
2. PCB Design  
Pattern configurations Inductor layout on panelizedbreakawayPC boards)  
1-1. The following are examples of good and bad inductor layout; SMD inductors should be located to minimize any possible mechanical stresses from board  
warp or deflection.  
Item  
Not recommended  
Recommended  
Deflection of the board  
1-2. To layout the inductors for the breakaway PC board, it should be noted that the amount of mechanical stresses given will vary depending on inductor layout.  
An example below should be counted for better design.  
Technical  
consider-  
ations  
1-3. When breaking PC boards along their perforations, the amount of mechanical stress on the inductors can vary according to the method used. The following  
methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, any ideal SMD inductor layout must  
also consider the PCB splitting procedure.  
3. Considerations for automatic placement  
Adjustment of mounting machine  
1. Excessive impact load should not be imposed on the inductors when mounting onto the PC boards.  
2. The maintenance and inspection of the mounter should be conducted periodically.  
Precautions Selection of Adhesives  
1. Mounting inductors with adhesives in preliminary assembly, before the soldering stage, may lead to degraded inductor characteristics unless the following  
factors are appropriately checked; the size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. Therefore, it is  
imperative to consult the manufacturer of the adhesives on proper usage and amounts of adhesive to use.  
Adjustment of mounting machine  
1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the inductors, causing damage. To avoid this, the following points should be  
considered before lowering the pick-up nozzle:  
1The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC board after correcting for deflection of the board.  
2The pick-up pressure should be adjusted between 1 and 3N static loads.  
3To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins should be used under the PC  
board. The following diagrams show some typical examples of good pick-up nozzle placement:  
Item  
Improper method  
Proper method  
Single-sided mounting  
Double-sided mounting  
2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or cracking of the inductors because of mechanical impact on the  
inductors. To avoid this, the monitoring of the width between the alignment pin in the stopped position, and maintenance, inspection and replacement of the  
pin should be conducted periodically.  
Technical  
consider-  
ations  
Selection of Adhesives  
1. Some adhesives may cause reduced insulation resistance. The difference between the shrinkage percentage of the adhesive and that of the inductors may  
result in stresses on the inductors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect component  
placement, so the following precautions should be noted in the application of adhesives.  
1Required adhesive characteristics  
a. The adhesive should be strong enough to hold parts on the board during the mounting & solder process.  
b. The adhesive should have sufficient strength at high temperatures.  
c. The adhesive should have good coating and thickness consistency.  
d. The adhesive should be used during its prescribed shelf life.  
e. The adhesive should harden rapidly.  
f. The adhesive must not be contaminated.  
g. The adhesive should have excellent insulation characteristics.  
h. The adhesive should not be toxic and have no emission of toxic gasses.  
2When using adhesives to mount inductors on a PCB, inappropriate amounts of adhesive on the board may adversely affect component placement. Too  
little adhesive may cause the inductors to fall off the board during the solder process. Too much adhesive may cause defective soldering due excessive  
flow of adhesive on to the land or solder pad.  
Recommended conditions]  
Figure  
0805 case sizes as examples  
0.3mm min  
a
b
c
100120μm  
Area with no adhesive  
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.  
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.  
mlci0109_reli_e-01  
mlci0109_reli-PRP14  
PRECAUTIONS  
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer chip bead Inductors  
4. Soldering  
Selection of Flux  
1. Since flux may have a significant effect on the performance of inductors, it is necessary to verify the following conditions prior to use;  
1Flux used should be with less than or equal to 0.1 wt%Chlorine conversion methodof halogenated content. Flux having a strong acidity content should  
not be applied.  
Precautions  
2When soldering inductors on the board, the amount of flux applied should be controlled at the optimum level.  
3When using water-soluble flux, special care should be taken to properly clean the boards.  
Soldering  
1. Temperature, time, amount of solder, etc. are specified in accordance with the following recommended conditions, and please contact us about peak tem-  
perature when you use lead-free paste.  
Selection of Flux  
1-1. When too much halogenated substanceChlorine, etc.content is used to activate the flux, or highly acidic flux is used, an excessive amount of residue  
after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the surface of the Inductor.  
1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a large amount of flux gas may be emitted and may detrimentally affect  
solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.  
1-3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the residue on the surface of Inductor in high humidity conditions may  
cause a degradation of insulation resistance and therefore affect the reliability of the components. The cleaning methods and the capability of the machines  
used should also be considered carefully when selecting water-soluble flux.  
Soldering  
1-1. Preheating when soldering  
Heating: Chip inductor components should be preheated to within 100 to 130of the soldering. Cooling: The temperature difference between the  
components and cleaning process should not be greater than 100.  
Chip inductors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. Therefore, the soldering process must be  
conducted with a great care so as to prevent malfunction of the components due to excessive thermal shock.  
Recommended conditions for soldering  
Reflow soldering]  
Temperature profile  
Temperature(℃)  
Pb free soldering)  
300  
Peak 260max  
10 sec max  
200  
100  
0
Gradually  
cooling  
Preheating  
150℃  
60 sec min  
Heating above 230℃  
40 sec max  
Ceramic chip components should be preheated to  
within 100 to 130of the soldering.  
Assured to be reflow soldering for 2 times.  
Caution  
1. The ideal condition is to have solder mass filletcontrolled to 1/2 to 1/3 of the thickness of the inductor, as shown below:  
2. Because excessive dwell times can detrimentally affect solderability, soldering duration should be kept as close to recommended times as possible.  
Technical  
consider-  
ations  
Wave soldering]  
Temperature profile  
Temperature(℃)  
Pb free soldering)  
300  
Peak 260max  
10 sec max  
200  
100  
0
Gradually  
cooling  
Preheating  
150℃  
120 sec min  
Ceramic chip components should be preheated to  
within 100 to 130of the soldering.  
Assured to be wave soldering for 1 time.  
Except for reflow soldering type.  
Caution  
1. Make sure the inductors are preheated sufficiently.  
2. The temperature difference between the inductor and melted solder should not be greater than 100 to 130.  
3. Cooling after soldering should be as gradual as possible.  
4. Wave soldering must not be applied to the inductors designated as for reflow soldering only.  
Hand soldering]  
Temperature profile  
Temperature(℃)  
Pb free soldering)  
400  
350max  
3 sec max  
300  
200  
Gradually  
cooling  
⊿T  
100  
0
60 sec min  
(※T1903216Type max, T≦ 1303225  
Type ming)  
It is recommended to use 20W soldering iron and  
the tip is 1φor less.  
The soldering iron should not directly touch the  
components.  
Assured to be soldering iron for 1 time.  
Note: The above profiles are the maximum allowable  
soldering condition, therefore these profiles are  
not always recommended.  
Caution  
1. Use a 20W soldering iron with a maximum tip diameter of 1.0 mm.  
2. The soldering iron should not directly touch the inductor.  
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.  
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.  
mlci0109_reli_e-01  
mlci0109_reli-PRP15  
PRECAUTIONS  
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer chip bead Inductors  
5. Cleaning  
Cleaning conditions  
1. When cleaning the PC board after the Inductors are all mounted, select the appropriate cleaning solution according to the type of flux used and purpose of  
the cleaninge.g. to remove soldering flux or other materials from the production process.)  
2. Cleaning conditions should be determined after verifying, through a test run, that the cleaning process does not affect the inductor's characteristics.  
Precautions  
Cleaning conditions  
1. The use of inappropriate solutions can cause foreign substances such as flux residue to adhere to the inductor, resulting in a degradation of the inductor's  
electrical properties especially insulation resistance.  
2. Inappropriate cleaning conditions insufficient or excessive cleaningmay detrimentally affect the performance of the inductors.  
Technical  
consider-  
ations  
1Excessive cleaning  
a. In the case of ultrasonic cleaning, too much power output can cause excessive vibration of the PC board which may lead to the cracking of the inductor  
or the soldered portion, or decrease the terminal electrodes' strength. Thus the following conditions should be carefully checked;  
Ultrasonic output  
Ultrasonic frequency  
Ultrasonic washing period  
Below 20W/ℓ  
Below 40kHz  
5 min. or less  
6. Post cleaning processes  
Application of resin coatings, moldings, etc. to the PCB and components.  
1. With some type of resins a decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal  
storage conditions resulting in the deterioration of the inductor's performance.  
2. When a resin's hardening temperature is higher than the inductor's operating temperature, the stresses generated by the excess heat may lead to inductor  
damage or destruction.  
3. Stress caused by a resin's temperature generated expansion and contraction may damage inductors.  
Precautions  
7. Handling  
The use of such resins, molding materials etc. is not recommended.  
Breakaway PC boards splitting along perforations)  
1. When splitting the PC board after mounting inductors and other components, care is required so as not to give any stresses of deflection or twisting to the  
board.  
2. Board separation should not be done manually, but by using the appropriate devices.  
General handling precautions  
1. Always wear static control bands to protect against ESD.  
2. Keep the inductors away from all magnets and magnetic objects.  
Precautions  
3. Use non-magnetic tweezers when handling inductors.  
4. Any devices used with the inductorssoldering irons, measuring instrumentsshould be properly grounded.  
5. Keep bare hands and metal products i.e., metal deskaway from chip electrodes or conductive areas that lead to chip electrodes.  
6. Keep inductors away from items that generate magnetic fields such as speakers or coils.  
Mechanical considerations  
1. Be careful not to subject the inductors to excessive mechanical shocks.  
1If inductors are dropped on the floor or a hard surface they should not be used.  
2When handling the mounted boards, be careful that the mounted components do not come in contact with or bump against other boards or components.  
8. Storage conditions  
Storage  
1. To maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control temperature and  
humidity in the storage area. Humidity should especially be kept as low as possible.  
Recommended conditions  
Ambient temperature Below 40℃  
Precautions  
Humidity  
Below 70% RH  
The ambient temperature must be kept below 30. Even under ideal storage conditions inductor electrode solderability decreases as time passes, so  
inductors should be used within 6 months from the time of delivery.  
*The packaging material should be kept where no chlorine or sulfur exists in the air.  
Storage  
Technical  
consider-  
ations  
1. If the parts are stocked in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes  
and deterioration of taping/packaging materials may take place. For this reason, components should be used within 6 months from the time of delivery. If  
exceeding the above period, please check solderability before using the inductors.  
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.  
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.  
mlci0109_reli_e-01  
mlci0109_reli-PRP16  

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